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1 of 12 optimum technology matching? applied gaas hbt ingap hbt gaas mesfet sige bicmos si bicmos sige hbt gaas phemt si cmos si bjt gan hemt functional block diagram rf micro devices?, rfmd?, optimum technology matching?, enabling wireless connectivity?, powerstar?, polaris? total radio? and ultimateblue? are trademarks of rfmd, llc. bluetooth is a trade- mark owned by bluetooth sig, inc., u.s.a. and licensed for use by rfmd. all other trade names, trademarks and registered tradem arks are the property of their respective owners. ?2006, rf micro devices, inc. product description 7628 thorndike road, greensboro, nc 27409-9421 for sales or technical support, contact rfmd at (+1) 336-678-5570 or sales-support@rfmd.com . ordering information 13 2 4 rf out rf in gnd gnd marking - n6 nbb-310 cascadable broadband gaas mmic amplifier dc to 12ghz the nbb-310 cascadable broadband ingap/gaas mmic amplifier is a low-cost, high-performance solution for general purpose rf and microwave amplification needs. this 50 gain block is based on a reliable hbt proprietary mmic design, providing unsurpassed performance for smal l-signal applications. designed with an external bias resistor, the nbb-310 provides flexibility and stability. the nbb-310 is packaged in a low-cost, surface-mount ce ramic package, providing ease of assem- bly for high-volume tape-and-reel requirements . it is available in either packaged or chip (nbb-310-d) form, where its gold me tallization is ideal for hybrid circuit designs. features ? reliable, low-cost hbt design ? 13db gain ? high p1db of +15.2dbm at 6ghz ? single power supply operation ? 50 i/o matched for high freq. use applications ? narrow and broadband commer- cial and military radio designs ? linear and saturated amplifiers ? gain stage or driver amplifiers for mwradio/optical designs (ptp/pmp/ lmds/unii/vsat/wlan/cellu- lar/dwdm) nbb-310 cascadable broadband gaas mmic amplifier dc to 12ghz NBB-310-T1 tape & reel, 1000 pieces nbb-310-d nbb-310 chip form (100 pieces minimum order) nbb-310-pcba-41x fully assembled evaluation board nbb-x-k1 extended frequency ingap amp designer?s tool kit rev a11 ds070327 9 rohs compliant & pb-free product package style: micro-x, 4-pin, ceramic
2 of 12 nbb-310 rev a11 ds070327 7628 thorndike road, greensboro, nc 27409-9421 for sales or technical support, contact rfmd at (+1) 336-678-5570 or sales-support@rfmd.com . absolute maximum ratings parameter rating unit rf input power +20 dbm power dissipation 350 mw device current 70 ma channel temperature 200 c operating temperature -45 to +85 c storage temperature -65 to +150 c exceeding any one or a combination of these limits may cause permanent damage. parameter specification unit condition min. typ. max. overall v d =+5v, i cc =50ma, z 0 =50 , t a =+25c small signal power gain, s21 12.5 13.0 db f=0.1ghz to 1.0ghz 12.0 12.5 db f=1.0ghz to 4.0ghz 11.0 11.5 db f = 4.0 ghz to 8.0 ghz 9.0 10.0 db f=8.0ghz to 12.0ghz gain flatness, gf 0.6 db f=0.1ghz to 8.0ghz input and output vswr 1.4:1 f=0.1ghz to 7.0ghz 1.75:1 f=7.0ghz to 10.0ghz 2.0:1 f=10.0ghz to 12.0ghz bandwidth, bw 12.0 ghz bw3 (3db) output power @ -1db compression, p1db 13.8 dbm f=2.0ghz 15.2 dbm f=6.0ghz 14.5 dbm f=8.0ghz 12.0 dbm f=12.0ghz noise figure, nf 4.9 db f=3.0ghz third order intercept, ip3 +24.0 dbm f=2.0ghz reverse isolation, s12 -17 db f=0.1ghz to 12.0ghz device voltage, v d 4.4 4.65 4.9 v gain temperature coefficient, g t / t -0.0015 db/c mttf versus temperature @ i cc =50ma case temperature 85 c junction temperature 139 c mttf >1,000,000 hours thermal resistance jc 216 c/w j t t case ? v d i cc ? -------------------------- - jc cwatt ? () = caution! esd sensitive device. the information in this publication is believed to be accurate and reliable. how- ever, no responsibility is assumed by rf micro devices, inc. ("rfmd") for its use, nor for any infringement of patents, or other rights of third parties, resulting from its use. no license is granted by implication or otherwise under any patent or patent rights of rfmd. rfmd reserves the right to change component cir- cuitry, recommended application circuitry and specifications at any time without prior notice.
3 of 12 nbb-310 rev a11 ds070327 7628 thorndike road, greensboro, nc 27409-9421 for sales or technical support, contact rfmd at (+1) 336-678-5570 or sales-support@rfmd.com . package drawing pin function description interface schematic 1rf in rf input pin. this pin is not internally dc blocked. a dc blocking capacitor, suitable for the frequency of operation, should be used in most applica- tions. dc coupling of the input is not allowed, because this will override the internal feedback loop and cause temperature instability. 2gnd ground connection. for best performance, keep traces physically short and connect immediately to ground plane. 3rf out rf output and bias pin. biasing is accomplished with an external series resistor and choke inductor to v cc . the resistor is selected to set the dc current into this pin to a desired level. the resistor value is determined by the following equation: care should also be taken in the resi stor selection to ensure that the cur- rent into the part never exceeds maximum datasheet operating current over the planned operating temperature. this means that a resistor between the supply and this pin is always required, even if a supply near 8.0v is available, to provide dc feedback to prevent thermal runaway. because dc is present on this pin, a dc blocking capacitor, suitable for the frequency of operation, should be used in most applications. the supply side of the bias network should also be well bypassed. 4gnd same as pin 2. r v cc v device ? () i cc ------------------------------------------- = rf out rf in units: inches (mm) n6 0.070 (1.78) 0.040 (1.02) 0.020 0.200 sq. (5.08) 45 0.055 (1.40) 0.005 (0.13)
4 of 12 nbb-310 rev a11 ds070327 7628 thorndike road, greensboro, nc 27409-9421 for sales or technical support, contact rfmd at (+1) 336-678-5570 or sales-support@rfmd.com . typical bias configuration application notes related to biasing circuit, device footpr int, and thermal considerations are available on request. recommended bias resistor values supply voltage, v cc (v) 8 10 12 15 20 bias resistor, r cc ( ) 60 100 140 200 300 c block 1 3 4 2 c block in out l choke (optional) r cc v cc v d = 5 v v device
5 of 12 nbb-310 rev a11 ds070327 7628 thorndike road, greensboro, nc 27409-9421 for sales or technical support, contact rfmd at (+1) 336-678-5570 or sales-support@rfmd.com . chip outline drawing - nbb-310-d chip dimensions: 0.017? x 0.017? x 0.004? sales criteria - unpackaged die die sales information ? all segmented die are sold 100% dc-tested. testing parameters for wafer-level sales of die material shall be nego- tiated on a case-by-case basis. ? segmented die are selected for customer shipment in accordance with rfmd document #6000152 - die product final visual inspection criteria 1 . ? segmented die has a minimum sales volume of 100 pieces per order. a maximum of 400 die per carrier is allow- able. die packaging ? all die are packaged in gelpak esd protective containers with the following specification: o.d.=2"x2", capacity=400 die (20x20 segments), retention level=high(x0). ? gelpak esd protective containers are placed in a static shield bag. rfmd recommends that once the bag is opened the gelpak/s should be stored in a controlled nitrogen environment. do not press on the cover of a closed gelpak, handle by the edges only. do not vacuum seal bags containing gelpak containers. ? precaution must be taken to minimize vibration of packaging during handling, as die can shift during transit 2 . package storage ? unit packages should be kept in a dry nitrogen environment for optimal assembly, perf ormance, and reliability. ? precaution must be taken to minimize vibration of packaging during handling, as die can shift during transit 2 . die handling ? proper esd precautions must be taken when handling die material. ? die should be handled using vacuum pick-up equipment, or handled along the long side with a sharp pair of twee- zers. do not touch die with any part of the body. ? when using automated pick-up and placement equipment, ensu re that force impact is set correctly. excessive force may damage gaas devices. input output gnd via 0.017 0.001 (0.44 0.03) 0.017 0.001 (0.44 0.03) 0.004 0.001 (0.10 0.03) units: inches (mm) back of chip is ground.
6 of 12 nbb-310 rev a11 ds070327 7628 thorndike road, greensboro, nc 27409-9421 for sales or technical support, contact rfmd at (+1) 336-678-5570 or sales-support@rfmd.com . die attach ? the die attach process mechanically attaches the die to the circuit substrate. in addition, the utilization of proper die attach processes electrically connect the ground to the tr ace on which the chip is mounted. it also establishes the thermal path by which heat can leave the chip. ? die should be mounted to a clean, flat surface. epoxy or eutectic die attach are both acceptable attachment meth- ods. top and bottom metallizat ion are gold. conductive silver-filled epoxies are re commended. this procedure involves the use of epoxy to form a jo int between the backside gold of the chip and the metalliz ed area of the sub- strate. ? all connections should be made on the topside of the die. it is essential to performance that the backside be well grounded and that the length of topside interconnects be minimized. ? some die utilize vias for effective ground ing. care must be exerci sed when mounting die to preclude excess run-out on the topside. die wire bonding ? electrical connections to the chip are made through wire bonds. either wedge or ball bonding methods are accept- able practices for wire bonding. ? all bond wires should be made as short as possible. notes 1 rfmd document #6000152 - die product final visual inspection criteria. this document provides guidance for die inspec- tion personnel to determine final visual acceptance of die product prior to shipping to customers. 2 rfmd takes precautions to ensure that die product is shipped in accordance with quality standards established to minimize material shift. however, due to the physical size of die-level product, rfmd does not guarantee that material will not shift du r- ing transit, especially under extreme handli ng circumstances. product replacement due to material shift will be at the discre- tion of rfmd.
7 of 12 nbb-310 rev a11 ds070327 7628 thorndike road, greensboro, nc 27409-9421 for sales or technical support, contact rfmd at (+1) 336-678-5570 or sales-support@rfmd.com . extended frequency ingap ampl ifier designer?s tool kit nbb-x-k1 this tool kit was created to assist in th e design-in of the rfmd nbb- and nlb-series ingap hbt gain block amplifiers. each tool kit contains the following. ? 5 each nbb-300, nbb-310 and nbb-400 ceramic micro-x amplifiers ? 5 each nlb-300, nlb-310 and nlb-400 plastic micro-x amplifiers ? 2 broadband evaluation boards and high frequency sma connectors ? broadband bias instructions and specification summary index for ease of operation
8 of 12 nbb-310 rev a11 ds070327 7628 thorndike road, greensboro, nc 27409-9421 for sales or technical support, contact rfmd at (+1) 336-678-5570 or sales-support@rfmd.com . tape and reel dimensions all dimensions in millimeters carrier tape basic dimensions are based on eia 481. the pocket is designed to hold the part for shipping and loading onto smt manufacturing equipment, while protecting the body and the solder terminals from damaging stresses. th e individual pocket design can vary from vendor to vendor, but width and pitch will be consistent. carrier tape is wound or placed onto a shipping reel 178 mm (7 inches) in diameter. the center hub design is large enough to ensure the radius formed by the carrier tape arou nd it does not put unnecessary stress on the parts. prior to shipping, moisture sensitive parts (msl level 2a-5a) ar e baked and placed into the pockets of the carrier tape. a cove r tape is sealed over the top of the entire length of the carrier tape. the reel is sealed in a moisture barrier esd bag with the appropriate units of desiccant and a humidity indicator card, whic h is placed in a cardboard shipping box. it is important to note that unused moisture sensitive parts need to be resealed in the moisture barrier bag. if the reels exceed the exposure limit and need to be rebaked, most carrier tape and shipping reels are not rated as bakeable at 125c. if baking is required, devices may be baked according to section 4, table 4-1, column 8 of joint industry standard ipc/jedec j-std-033. table 1 provides useful information for carrier tape and reel s used for shipping the devices described in this document. table 1. tape and reel rfmd part number reel diameter inch (mm) hub diameter inch (mm) width (mm) pocket pitch (mm) feed units per reel nbb-310 7 (178) 2.4 (61) 12 8 single 1000 figure 1. carrier ta pe drawing with part orientation w p 2.00.05 4.0 see note 3 1.75 f ko 0.30.05 ao = 5.8 .1 bo = 6.1 .1 f = 5.50 .05 ko = 2.0 .1 p = 8.0 .1 w = 12.0 .3 notes: 1. all dimensions are in millimeters (mm). 2. unless otherwise specified, all dimension tolerances per eia-481. 3. 10 sprocket hole pitch cumulative tolerance .02. direction of feed sprocket holes toward rear of reel pin 1 location 15 inch trailer top view 15 inch leader ?1.5 +.1 .0 ao 3.1.1 1.3.1 bo 3.1.1 1.3.1
9 of 12 nbb-310 rev a11 ds070327 7628 thorndike road, greensboro, nc 27409-9421 for sales or technical support, contact rfmd at (+1) 336-678-5570 or sales-support@rfmd.com . p1db versus frequency at 25c 0.0 5.0 10.0 15.0 20.0 1.0 3.0 5.0 7.0 9.0 11.0 13.0 15.0 frequency (ghz) p1db (dbm) p out /gain versus p in at 14 ghz 0.0 2.0 4.0 6.0 8.0 10.0 12.0 14.0 16.0 18.0 -15.0 -10.0 -5.0 0.0 5.0 10.0 p in (dbm) p out (dbm), gain (db) pout (dbm) gain (db) p out /gain versus p in at 6 ghz -2.0 0.0 2.0 4.0 6.0 8.0 10.0 12.0 14.0 16.0 18.0 20.0 -14.0 -9.0 -4.0 1.0 6.0 p in (dbm) p out (dbm), gain (db) pout (dbm) gain (db) third order intercept versus frequency at 25c 0.0 5.0 10.0 15.0 20.0 25.0 30.0 1.0 3.0 5.0 7.0 9.0 11.0 13.0 15.0 frequency (ghz) output ip3 (dbm)
10 of 12 nbb-310 rev a11 ds070327 7628 thorndike road, greensboro, nc 27409-9421 for sales or technical support, contact rfmd at (+1) 336-678-5570 or sales-support@rfmd.com . note: the s-parameter gain results shown below include device performance as well as evaluation board and connector loss variations. the insertion losses of the evaluation board and connectors are as follows: 1ghz to 4ghz=-0.06db 5ghz to 9ghz=-0.22db 10ghz to 14ghz=-0.50db 15ghz to 20ghz=-1.08db s11 versus frequency, over temperature -60.0 -50.0 -40.0 -30.0 -20.0 -10.0 0.0 0.0 2.0 4.0 6.0 8.0 10.0 12.0 14.0 frequency (ghz) s11 (db) +25 c -40 c +85 c s12 versus frequency, over temperature -20.0 -18.0 -16.0 -14.0 -12.0 -10.0 -8.0 -6.0 -4.0 -2.0 0.0 2.0 4.0 6.0 8.0 10.0 12.0 14.0 frequency (ghz) s12 (db) +25 c -40 c +85 c s21 versus frequency, over temperature 0.0 2.0 4.0 6.0 8.0 10.0 12.0 14.0 16.0 0.0 2.0 4.0 6.0 8.0 10.0 12.0 14.0 frequency (ghz) s21 (db) +25 c -40 c +85 c s22 versus frequency, over temperature -50.0 -45.0 -40.0 -35.0 -30.0 -25.0 -20.0 -15.0 -10.0 -5.0 0.0 0.0 2.0 4.0 6.0 8.0 10.0 12.0 14.0 frequency (ghz) s22 (db) +25 c -40 c +85 c
11 of 12 nbb-310 rev a11 ds070327 7628 thorndike road, greensboro, nc 27409-9421 for sales or technical support, contact rfmd at (+1) 336-678-5570 or sales-support@rfmd.com . rohs compliant: yes package total weight in grams (g): 0.019 compliance date code: 0439 bill of materials revision: - pb free category: e3 pb cd hg cr vi pbb pbde die 000000 molding compound 000000 lead frame 000000 die attach epoxy 000000 wire 000000 solder plating 000000 * directive 2002/95/ec of the european parliament and of the council of 27 january 2003 on the restriction of the use of certain hazardous substances in electrical and electronic equipment rohs* banned material content bill of materials parts per million (ppm) this rohs banned material content declaration was prepared solely on information, including analytical data, provided to rfmd by its suppliers, and applies to the bill of materials (bom) revision noted
12 of 12 nbb-310 rev a11 ds070327 7628 thorndike road, greensboro, nc 27409-9421 for sales or technical support, contact rfmd at (+1) 336-678-5570 or sales-support@rfmd.com .

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